SymbolJXAMY
NameJX ADVANCED METALS CORP.
SectorUNDEFINED
RegionAsia
Industry-
Address105-8417 Japan The Okura Prestige Tower 10-4 Toranomon 2-chome
Telephone+81 3-6433-6088
Fax
Email
Websitehttps://www.jx-nmm.com/english/
IncorporationJP
Incorporated On2002
Employees
Fiscal Year3/31
Public Since
ExchangesOTC;Pink Limited
Auditor
Audit StatusNOT AVAILABLE
Reporting StatusInternational Reporting: Tokyo Stock Exchange
CIK0002065485
Description

JX Advanced Metals Corporation engages in a range of nonferrous metal businesses. It focuses on copper and minor metals, spanning from mineral resources to smelting and recycling, and the manufacture and development of materials. The company provides copper alloys and special steel products; metal and compound powders; copper foil; sputtering targets; compound semiconductors and crystal materials; special ceramic powders; high purity metals; surface treatment agents; upinorg (high-purity copper sulfate); electroless UBM plating service; heater; shielding materials; and nonferrous metals and chemical products.

Additional info from OTC:
JX Advanced Metals Corporation engages in a range of nonferrous metal businesses. It focuses on copper and minor metals, spanning from mineral resources to smelting and recycling, and the manufacture and development of materials. The company provides copper alloys and special steel products; metal and compound powders; copper foil; sputtering targets; compound semiconductors and crystal materials; special ceramic powders; high purity metals; surface treatment agents; upinorg (high-purity copper sulfate); electroless UBM plating service; heater; shielding materials; and nonferrous metals and chemical products.

Additional info from Pink Limited:
JX Advanced Metals Corporation engages in a range of nonferrous metal businesses. It focuses on copper and minor metals, spanning from mineral resources to smelting and recycling, and the manufacture and development of materials. The company provides copper alloys and special steel products; metal and compound powders; copper foil; sputtering targets; compound semiconductors and crystal materials; special ceramic powders; high purity metals; surface treatment agents; upinorg (high-purity copper sulfate); electroless UBM plating service; heater; shielding materials; and nonferrous metals and chemical products.

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