SymbolPLNOF
NamePLAN OPTIK AG
SectorUNDEFINED
RegionUNDEFINED
Industry-
Address56479 Germany Ueber der Bitz 3
Telephone+49 2664 5068 0
Fax
Email
Websitehttps://planoptik.com/
Incorporation
Incorporated On
Employees
Fiscal Year12/31
Public Since
ExchangesOTC
Auditor
Audit StatusNOT AVAILABLE
Reporting StatusInternational Reporting: Borse Berlin
CIK
Description

Planoptik AG manufactures and sells structured wafers in Germany. It offers glass wafers comprising borosilicate, quartz, fused silica, alkaline free, and silicon-on-glass wafers; carriers and tools, such as chemical release, thermal release, laser release, and mechanical release carrier, as well as adapter wafer and handling tools; packaging wafers, including through hole wafers, cavity wafers, trenched wafers, customized cap solutions, and wafers with structured SI-layers; interposers, which include glass interposers, SI interposers, through glass vias, and redistribution layers; microfluidics comprising micro reactors, fluidic chips, flow chemistry sets, and sensors; and prototyping, such as rapid prototyping, vacuum casting, injection moulding, and mechanical processing. The company also provides services, such as patterning, wafer thinning, coating, wire sawing, and bonding services. It serves consumer electronics, automotive, aerospace, chemistry, and pharmaceutical industries.

Additional info from OTC:
Planoptik AG manufactures and sells structured wafers in Germany. It offers glass wafers comprising borosilicate, quartz, fused silica, alkaline free, and silicon-on-glass wafers; carriers and tools, such as chemical release, thermal release, laser release, and mechanical release carrier, as well as adapter wafer and handling tools; packaging wafers, including through hole wafers, cavity wafers, trenched wafers, customized cap solutions, and wafers with structured SI-layers; interposers, which include glass interposers, SI interposers, through glass vias, and redistribution layers; microfluidics comprising micro reactors, fluidic chips, flow chemistry sets, and sensors; and prototyping, such as rapid prototyping, vacuum casting, injection moulding, and mechanical processing. The company also provides services, such as patterning, wafer thinning, coating, wire sawing, and bonding services. It serves consumer electronics, automotive, aerospace, chemistry, and pharmaceutical industries.

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