| Description |
The ASA Group of Companies started in 1978 as a precision engineering company
manufacturing semiconductor tools and spares. Since then, the Group has
strategically molded its core business towards manufacturing automation
equipment for the encapsulation of semiconductors. ASA’s equipment is used in
IC manufacturing processes. It also supplies machines for the back-end assembly
of ICs.
Today, the Group is an international manufacturer of automated backend
equipment for the semiconductor assembly process. Its equipment are sold
worldwide to major semiconductor manufacturers such as ST Microelectronics
Group, Kemet Electronics Portugal, S.A., Global Advanced Packaging Technology,
Carsem Group and Cypress Manufacturing Limited.
To enhance ASA’s position in the Flip-chip arena, Advanpack Solutions Pte Ltd
was formed in January 1997 to acquire infrastructure capabilities critical for
the packaging shift from wirebonded package to Flip-chip. Today, the ASA Group
has the capability to provide a comprehensive Flipchip solution combining APS’s
technology, processes and material such as Pillar Bumping and No-Flow Underfill
with ASA’s equipment.
Additional info from SGX:
The ASA Group of Companies started in 1978 as a precision engineering company
manufacturing semiconductor tools and spares. Since then, the Group has
strategically molded its core business towards manufacturing automation
equipment for the encapsulation of semiconductors. ASA’s equipment is used in
IC manufacturing processes. It also supplies machines for the back-end assembly
of ICs.
Today, the Group is an international manufacturer of automated backend
equipment for the semiconductor assembly process. Its equipment are sold
worldwide to major semiconductor manufacturers such as ST Microelectronics
Group, Kemet Electronics Portugal, S.A., Global Advanced Packaging Technology,
Carsem Group and Cypress Manufacturing Limited.
To enhance ASA’s position in the Flip-chip arena, Advanpack Solutions Pte Ltd
was formed in January 1997 to acquire infrastructure capabilities critical for
the packaging shift from wirebonded package to Flip-chip. Today, the ASA Group
has the capability to provide a comprehensive Flipchip solution combining APS’s
technology, processes and material such as Pillar Bumping and No-Flow Underfill
with ASA’s equipment.
|
|---|